Summary
As the world continues to deal with COVID-19, economies are moving into recession, under multiple adverse factors, the GDP of European and American countries in the second quarter suffered a historical contraction. At an annualized rate, the US GDP fell by 32.9% month on month, while the overall GDP of the euro zone fell by 12.1%.
Moreover, the economic prospects of Europe and the United States in the third quarter under the epidemic situation are hardly optimistic. The resumption of work and production not only brought economic data back, but also triggered a rebound in the epidemic situation. At present, the United States is still the 'epicenter' of the global epidemic. The total number of confirmed cases has exceeded 4.8 million, and the epidemic situation in some European countries has also rebounded. Affected by this, more than 20 states in the United States have announced the suspension or withdrawal of part of the economic restart plan. Britain and Italy have also decided to extend the state of emergency. The rebound of the epidemic situation has posed considerable risks to the economic prospects of Europe and the United States.
In the second quarter of this year, US GDP shrank by 9.5% on a month on month basis, or 32.9% at an annual rate, the largest decline since the 1940s. Data show that the sharp decline in personal consumption is the main drag on the U.S. GDP growth in the second quarter.
Compared with the United States, Europe's economic contraction in the second quarter was smaller, but it was also the lowest on record, with Germany and France contracting more than 10%. According to the data released by the Federal Bureau of statistics, Germany's GDP fell by 10.1% in the second quarter after adjusting for prices, seasons and working days, the largest decline since the quarterly economic data were available in 1970.
Thanks to the effective control and policy support of the new epidemic, China's economy rebounded sharply in the second quarter. The growth rate of manufacturing industry, which accounted for about 28% of GDP, rebounded sharply to 4.4% from the negative value in the first quarter. Chinese original equipment manufacturers (OEMs) and suppliers are ramping up production. And there are increased investments in digital footprints in manufacturing. OEMs in other parts of the world are offering incentives to drive sales. XYZResearch published a report for global SEMICONDUCTOR ADVANCED PACKAGING market in this environment.
In terms of revenue, this research report indicated that the global SEMICONDUCTOR ADVANCED PACKAGING market was valued at USD XXX million in 2019, and it is expected to reach a value of USD XXX million by 2026, at a CAGR of XX % over the forecast period 2021-2026. Correspondingly, the forecast analysis of SEMICONDUCTOR ADVANCED PACKAGING industry comprises of China, USA, Japan, India, Korea and South America, with the production and revenue data in each of the sub-segments.
The Advanced Semiconductor Engineering aims at producing XX SEMICONDUCTOR ADVANCED PACKAGING in 2020, with XX % production to take place in global market, Amkor Technology accounts for a volume share of XX %.
Regional Segmentation (Value; Revenue, USD Million, 2015 - 2026) of SEMICONDUCTOR ADVANCED PACKAGING Market by XYZResearch Include
China
EU
USA
Japan
India
Southeast Asia
South America
Competitive Analysis; Who are the Major Players in SEMICONDUCTOR ADVANCED PACKAGING Market?
Advanced Semiconductor Engineering
Amkor Technology
Samsung Semiconductor
TSMC
China Wafer Level CSP
ChipMOS TECHNOLOGIES
FlipChip International
HANA Micron
Interconnect Systems (Molex)
Jiangsu Changjiang Electronics Technology (JCET)
King Yuan Electronics
Tongfu Microelectronics
Nepes
Powertech Technology (PTI)
SIGNETICS
Tianshui Huatian
Ultratech
UTAC
...
Major Type of SEMICONDUCTOR ADVANCED PACKAGING Covered in XYZResearch report:
FO WLP
2.5D/3D
FI WLP
Flip Chip
Application Segments Covered in XYZResearch Market
CMOS image sensors
Wireless connectivity devices
Logic and memory devices
MEMS and sensors
Analog and mixed ICs
For any other requirements, please feel free to contact us and we will provide you customized report.
Table of Contents
Global SEMICONDUCTOR ADVANCED PACKAGING Market Analysis 2020, With Top Companies, Production, Revenue, Consumption, Price and Growth Rate
1 Market Scope
1.1 Product Details and Introduction
1.1.1 FO WLP -Product Introduction and Major Manufacturers
1.1.2 2.5D/3D -Product Introduction and Major Manufacturers
1.1.3 FI WLP -Product Introduction and Major Manufacturers
1.1.4 Flip Chip -Product Introduction and Major Manufacturers
1.2 Market Snapshot
1.2.1 Major Companies Overview
1.2.2 Market Concentration
1.2.3 Six-Year Compound Annual Growth Rate (CAGR)
2 Global SEMICONDUCTOR ADVANCED PACKAGING Market Assessment, by Segmentation
2.1 Type Breakdown Estimates & Forecast, Sales Volume (2015-2026)
2.2 Type Breakdown Estimates & Forecast, Sales Value (2015-2026)
2.3 Application Breakdown Estimates & Forecast, by Application (2015-2026)
3 Regional Market Analysis
3.1 China SEMICONDUCTOR ADVANCED PACKAGING Market
3.1.1 Top Companies leading SEMICONDUCTOR ADVANCED PACKAGING Development in China (2015-2020)
3.1.2 Sales Value of Major Company in China Market (2015-2020)
3.1.3 China SEMICONDUCTOR ADVANCED PACKAGING Price (USD/Unit), by Type (2019-2020)
3.1.4 Sales in China Market, by Type (2015-2026)
3.2 EU SEMICONDUCTOR ADVANCED PACKAGING Market
3.2.1 Top Companies leading SEMICONDUCTOR ADVANCED PACKAGING Development in EU (2015-2020)
3.2.2 Sales Value of Major Company in EU Market (2015-2020)
3.2.3 EU SEMICONDUCTOR ADVANCED PACKAGING Price (USD/Unit), by Type (2019-2020)
3.2.4 Sales in EU Market, by Type (2015-2026)
3.3 USA SEMICONDUCTOR ADVANCED PACKAGING Market
3.3.1 Top Companies leading SEMICONDUCTOR ADVANCED PACKAGING Development in USA (2015-2020)
3.3.2 Sales Value of Major Company in USA Market (2015-2020)
3.3.3 USA SEMICONDUCTOR ADVANCED PACKAGING Price (USD/Unit), by Type (2019-2020)
3.3.4 Sales in USA Market, by Type (2015-2026)
3.4 Japan SEMICONDUCTOR ADVANCED PACKAGING Market
3.4.1 Top Companies leading SEMICONDUCTOR ADVANCED PACKAGING Development in Japan (2015-2020)
3.4.2 Sales Value of Major Company in Japan Market (2015-2020)
3.4.3 Japan SEMICONDUCTOR ADVANCED PACKAGING Price (USD/Unit), by Type (2019-2020)
3.4.4 Sales in Japan Market, by Type (2015-2026)
3.5 India SEMICONDUCTOR ADVANCED PACKAGING Market
3.5.1 Top Companies leading SEMICONDUCTOR ADVANCED PACKAGING Development in India (2015-2020)
3.5.2 Sales Value of Major Company in India Market (2015-2020)
3.5.3 India SEMICONDUCTOR ADVANCED PACKAGING Price (USD/Unit), by Type (2019-2020)
3.5.4 Sales in India Market, by Type (2015-2026)
3.6 Southeast Asia SEMICONDUCTOR ADVANCED PACKAGING Market
3.6.1 Top Companies leading SEMICONDUCTOR ADVANCED PACKAGING Development in Southeast Asia (2015-2020)
3.6.2 Sales Value of Major Company in Southeast Asia Market (2015-2020)
3.6.3 Southeast Asia SEMICONDUCTOR ADVANCED PACKAGING Price (USD/Unit), by Type (2019-2020)
3.6.4 Sales in Southeast Asia Market, by Type (2015-2026)
3.7 South America SEMICONDUCTOR ADVANCED PACKAGING Market
3.7.1 Top Companies leading SEMICONDUCTOR ADVANCED PACKAGING Development in South America (2015-2020)
3.7.2 Sales Value of Major Company in South America Market (2015-2020)
3.7.3 South America SEMICONDUCTOR ADVANCED PACKAGING Price (USD/Unit), by Type (2019-2020)
3.7.4 Sales in South America Market, by Type (2015-2026)
4 Value Chain (Impact of COVID-19)
4.1 SEMICONDUCTOR ADVANCED PACKAGING Value Chain Analysis
4.1.1 Upstream
4.1.2 Downstream
4.2 COVID-19 Impact on SEMICONDUCTOR ADVANCED PACKAGING Industry
4.2.1 Industrial Policy Issued Under the Epidemic Situation
4.3 Cost-Under the Epidemic Situation
4.3.1 Cost of Raw Material
4.4 Channel Analysis
4.4.1 Distribution Channel-Under the Epidemic Situation
4.4.2 Distributors
5 Regional Market Forecast (2021-2026)
5.1 Global SEMICONDUCTOR ADVANCED PACKAGING Sales and Growth Rate (2021-2026)
5.2 Global SEMICONDUCTOR ADVANCED PACKAGING Sales Value and Growth Rate (2021-2026)
6 SEMICONDUCTOR ADVANCED PACKAGING Competitive Analysis
6.1 Advanced Semiconductor Engineering
6.1.1 Advanced Semiconductor Engineering Company Profiles
6.1.2 Advanced Semiconductor Engineering Product Introduction
6.1.3 Advanced Semiconductor Engineering SEMICONDUCTOR ADVANCED PACKAGING Production, Revenue (2015-2020)
6.1.4 SWOT Analysis
6.2 Amkor Technology
6.2.1 Amkor Technology Company Profiles
6.2.2 Amkor Technology Product Introduction
6.2.3 Amkor Technology SEMICONDUCTOR ADVANCED PACKAGING Production, Revenue (2015-2020)
6.2.4 SWOT Analysis
6.3 Samsung Semiconductor
6.3.1 Samsung Semiconductor Company Profiles
6.3.2 Samsung Semiconductor Product Introduction
6.3.3 Samsung Semiconductor SEMICONDUCTOR ADVANCED PACKAGING Production, Revenue (2015-2020)
6.3.4 SWOT Analysis
6.4 TSMC
6.4.1 TSMC Company Profiles
6.4.2 TSMC Product Introduction
6.4.3 TSMC SEMICONDUCTOR ADVANCED PACKAGING Production, Revenue (2015-2020)
6.4.4 SWOT Analysis
6.5 China Wafer Level CSP
6.5.1 China Wafer Level CSP Company Profiles
6.5.2 China Wafer Level CSP Product Introduction
6.5.3 China Wafer Level CSP SEMICONDUCTOR ADVANCED PACKAGING Production, Revenue (2015-2020)
6.5.4 SWOT Analysis
6.6 ChipMOS TECHNOLOGIES
6.6.1 ChipMOS TECHNOLOGIES Company Profiles
6.6.2 ChipMOS TECHNOLOGIES Product Introduction
6.6.3 ChipMOS TECHNOLOGIES SEMICONDUCTOR ADVANCED PACKAGING Production, Revenue (2015-2020)
6.6.4 SWOT Analysis
6.7 FlipChip International
6.7.1 FlipChip International Company Profiles
6.7.2 FlipChip International Product Introduction
6.7.3 FlipChip International SEMICONDUCTOR ADVANCED PACKAGING Production, Revenue (2015-2020)
6.7.4 SWOT Analysis
6.8 HANA Micron
6.8.1 HANA Micron Company Profiles
6.8.2 HANA Micron Product Introduction
6.8.3 HANA Micron SEMICONDUCTOR ADVANCED PACKAGING Production, Revenue (2015-2020)
6.8.4 SWOT Analysis
6.9 Interconnect Systems (Molex)
6.9.1 Interconnect Systems (Molex) Company Profiles
6.9.2 Interconnect Systems (Molex) Product Introduction
6.9.3 Interconnect Systems (Molex) SEMICONDUCTOR ADVANCED PACKAGING Production, Revenue (2015-2020)
6.9.4 SWOT Analysis
6.10 Jiangsu Changjiang Electronics Technology (JCET)
6.10.1 Jiangsu Changjiang Electronics Technology (JCET) Company Profiles
6.10.2 Jiangsu Changjiang Electronics Technology (JCET) Product Introduction
6.10.3 Jiangsu Changjiang Electronics Technology (JCET) SEMICONDUCTOR ADVANCED PACKAGING Production, Revenue (2015-2020)
6.10.4 SWOT Analysis
6.11 King Yuan Electronics
6.12 Tongfu Microelectronics
6.13 Nepes
6.14 Powertech Technology (PTI)
6.15 SIGNETICS
6.16 Tianshui Huatian
6.17 Ultratech
6.18 UTAC
7 Conclusion
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