Summary
Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit.
The global Electronic Packaging Materials market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including:
Global market size and forecast
Regional market size, production data and export & import
Key manufacturers profile, products & services, sales data of business
Global market size by Major Application
Global market size by Major Type
Key manufacturers are included based on company profile, sales data and product specifications etc.:
DuPont
Evonik
EPM
Mitsubishi Chemical
Sumitomo Chemical
Mitsui High-tec
Tanaka
Shinko Electric Industries
Panasonic
Hitachi Chemical
Kyocera Chemical
Gore
BASF
Henkel
AMETEK Electronic
Toray
Maruwa
Leatec Fine Ceramics
NCI
Chaozhou Three-Circle
Nippon Micrometal
Toppan
Dai Nippon Printing
Possehl
Ningbo Kangqiang
Major applications as follows:
Semiconductor & IC
PCB
Others
Major Type as follows:
Metal Packages
Plastic Packages
Ceramic Packages
Regional market size, production data and export & import:
Asia-Pacific
North America
Europe
South America
Middle East & Africa
Table of Contents
1 Global Market Overview
1.1 Scope of Statistics
1.1.1 Scope of Products
1.1.2 Scope of Manufacturers
1.1.3 Scope of Application
1.1.4 Scope of Type
1.1.5 Scope of Regions/Countries
1.2 Global Market Size
2 Regional Market
2.1 Regional Production
2.2 Regional Demand
2.3 Regional Trade
3 Key Manufacturers
3.1 DuPont
3.1.1 Company Information
3.1.2 Product & Services
3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.1.4 Recent Development
3.2 Evonik
3.2.1 Company Information
3.2.2 Product & Services
3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.2.4 Recent Development
3.3 EPM
3.3.1 Company Information
3.3.2 Product & Services
3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.3.4 Recent Development
3.4 Mitsubishi Chemical
3.4.1 Company Information
3.4.2 Product & Services
3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.4.4 Recent Development
3.5 Sumitomo Chemical
3.5.1 Company Information
3.5.2 Product & Services
3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.5.4 Recent Development
3.6 Mitsui High-tec
3.6.1 Company Information
3.6.2 Product & Services
3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.6.4 Recent Development
3.7 Tanaka
3.7.1 Company Information
3.7.2 Product & Services
3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.7.4 Recent Development
3.8 Shinko Electric Industries
3.8.1 Company Information
3.8.2 Product & Services
3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.8.4 Recent Development
3.9 Panasonic
3.9.1 Company Information
3.9.2 Product & Services
3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.9.4 Recent Development
3.10 Hitachi Chemical
3.10.1 Company Information
3.10.2 Product & Services
3.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.10.4 Recent Development
3.11 Kyocera Chemical
3.11.1 Company Information
3.11.2 Product & Services
3.11.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.11.4 Recent Development
3.12 Gore
3.12.1 Company Information
3.12.2 Product & Services
3.12.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.12.4 Recent Development
3.13 BASF
3.13.1 Company Information
3.13.2 Product & Services
3.13.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.13.4 Recent Development
3.14 Henkel
3.14.1 Company Information
3.14.2 Product & Services
3.14.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.14.4 Recent Development
3.15 AMETEK Electronic
3.15.1 Company Information
3.15.2 Product & Services
3.15.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.15.4 Recent Development
3.16 Toray
3.16.1 Company Information
3.16.2 Product & Services
3.16.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.16.4 Recent Development
3.17 Maruwa
3.17.1 Company Information
3.17.2 Product & Services
3.17.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.17.4 Recent Development
3.18 Leatec Fine Ceramics
3.18.1 Company Information
3.18.2 Product & Services
3.18.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.18.4 Recent Development
3.19 NCI
3.19.1 Company Information
3.19.2 Product & Services
3.19.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.19.4 Recent Development
3.20 Chaozhou Three-Circle
3.20.1 Company Information
3.20.2 Product & Services
3.20.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.20.4 Recent Development
3.21 Nippon Micrometal
3.21.1 Company Information
3.21.2 Product & Services
3.21.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.21.4 Recent Development
3.22 Toppan
3.22.1 Company Information
3.22.2 Product & Services
3.22.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.22.4 Recent Development
3.23 Dai Nippon Printing
3.23.1 Company Information
3.23.2 Product & Services
3.23.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.23.4 Recent Development
3.24 Possehl
3.24.1 Company Information
3.24.2 Product & Services
3.24.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.25 Ningbo Kangqiang
3.25.1 Company Information
3.25.2 Product & Services
3.25.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
4 Major Application
4.1 Semiconductor & IC
4.1.1 Overview
4.1.2 Semiconductor & IC Market Size and Forecast
4.2 PCB
4.2.1 Overview
4.2.2 PCB Market Size and Forecast
4.3 Others
4.3.1 Overview
4.3.2 Others Market Size and Forecast
5 Market by Type
5.By Metal Packages
5.1 Metal Packages
5.1.1 Overview
5.1.2 Metal Packages Market Size and Forecast
5.2 Plastic Packages
5.2.1 Overview
5.2.2 Plastic Packages Market Size and Forecast
5.3 Ceramic Packages
5.3.1 Overview
5.3.2 Ceramic Packages Market Size and Forecast
6 Price Overview
6.1 Price by Manufacturers
6.2 Price by Application
6.3 Price by Type
7 Conclusion
Fig Global Electronic Packaging Materials Market Size and CAGR 2013-2018 (Million USD)
Fig Global Electronic Packaging Materials Market Size and CAGR 2013-2018 (Volume)
Fig Global Electronic Packaging Materials Market Forecast and CAGR 2019-2025 (Million USD)
Fig Global Electronic Packaging Materials Market Forecast and CAGR 2019-2025 (Volume)
Fig Semiconductor & IC Market Size and CAGR 2013-2018 (Million USD)
Fig Semiconductor & IC Market Size and CAGR 2013-2018 (Volume)
Fig Semiconductor & IC Market Forecast and CAGR 2019-2025 (Million USD)
Fig Semiconductor & IC Market Forecast and CAGR 2019-2025 (Volume)
Fig PCB Market Size and CAGR 2013-2018 (Million USD)
Fig PCB Market Size and CAGR 2013-2018 (Volume)
Fig PCB Market Forecast and CAGR 2019-2025 (Million USD)
Fig PCB Market Forecast and CAGR 2019-2025 (Volume)
Fig Others Market Size and CAGR 2013-2018 (Million USD)
Fig Others Market Size and CAGR 2013-2018 (Volume)
Fig Others Market Forecast and CAGR 2019-2025 (Million USD)
Fig Others Market Forecast and CAGR 2019-2025 (Volume)
Fig Metal Packages Market Size and CAGR 2013-2018 (Million USD)
Fig Metal Packages Market Size and CAGR 2013-2018 (Volume)
Fig Metal Packages Market Forecast and CAGR 2019-2025 (Million USD)
Fig Metal Packages Market Forecast and CAGR 2019-2025 (Volume)
Fig Plastic Packages Market Size and CAGR 2013-2018 (Million USD)
Fig Plastic Packages Market Size and CAGR 2013-2018 (Volume)
Fig Plastic Packages Market Forecast and CAGR 2019-2025 (Million USD)
Fig Plastic Packages Market Forecast and CAGR 2019-2025 (Volume)
Fig Ceramic Packages Market Size and CAGR 2013-2018 (Million USD)
Fig Ceramic Packages Market Size and CAGR 2013-2018 (Volume)
Fig Ceramic Packages Market Forecast and CAGR 2019-2025 (Million USD)
Fig Ceramic Packages Market Forecast and CAGR 2019-2025 (Volume)
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