Summary
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. Components - capacitors, resistors or active devices - are generally soldered on the PCB. PCBA refer to Printed Circuit Board Assembly. In assembly the bare board is populated (or "stuffed") with electronic components to form a functional printed circuit assembly (PCA), which called a "printed circuit board assembly" (PCBA)
HeyReport estimates that the PCB & PCBA market size will grow from xxx Million USD in 2020 to xxxx Million USD by 2025, and with a CAGR of xx%. The base year considered for this report is 2019, and the market forecast is projected from 2021 to 2025.
In this report, HeyReport discusses the Global & China industrial policies, economic environment, and the impact of covid-19 on the PCB & PCBAindustry and its cost structure. Besides, this report covers the basic market dynamics, market size and companies competition data. In addition, the report also conducts basic market research on major product type, market end-use and regional trade.
Market Segment as follows:
Product Type Segmentation Includes
Rigid 1-2Sided
Standard Multilayer
HDI/Microvia/Build-Up
IC Substrate
Flexible Circuits
Rigid Flex
Others
Application Segmentation Includes
Consumer electronics
Computer
Communications
Industrial/Medical
Automotive
Military/Aerospace
Others
Companies Includes
Nippon Mektron
Unimicron
SEMCO
Young Poong Group
Ibiden
ZDT
Tripod
TTM
SEI
Daeduck Group
HannStar Board (GBM)
Viasystems
Nanya PCB
CMK Corporation
Shinko Electric Ind
Compeq
AT&S
Kingboard
Ellington
Junda Electronic
CCTC
Redboard
Wuzhou Group
Kinwong
Aoshikang
Shennan Circuits
The main contents of the report including:
Section 1:
Product definition, type and application, Global & China market overview;
Section 2:
Global & China Market competition by company;
Section 3:
Global & China sales revenue, volume and price by type;
Section 4:
Global & China sales revenue, volume and price by application;
Section 5:
China export and import;
Section 6:
Company information, business overview, sales data and product specifications;
Section 7:
Industry chain and raw materials;
Section 8:
Industrial policies & economic environment
Section 9:
Conclusion.
For any other requirements, please feel free to contact HeyReport for customized contents.
Table of Contents
1 Market Overview
1.1 Market Segment Overview
1.1.1 Product Definition
1.1.2 Market by Type
1.1.2.1 Rigid 1-2Sided
1.1.2.2 Standard Multilayer
1.1.2.3 HDI/Microvia/Build-Up
1.1.2.4 IC Substrate
1.1.2.5 Flexible Circuits
1.1.2.6 Rigid Flex
1.1.2.7 Others
1.1.3 Market by Application
1.1.3.1 Consumer electronics
1.1.3.2 Computer
1.1.3.3 Communications
1.1.3.4 Industrial/Medical
1.1.3.5 Automotive
1.1.3.6 Military/Aerospace
1.1.3.7 Others
1.2 Global & China Market Size & Forecast
1.2.1 Global Market (2015-2020 & 2021-2026)
1.2.2 China Market (2015-2020 & 2021-2026)
2 Global & China Market by Company
2.1 Global Sales by Company
2.2 China Sales by Company
3 Global & China Market by Type
3.1 Global Sales by Product Type
3.2 China Sales by Product Type
4 Global & China Market by Application
4.1 Global Sales by Application
4.2 China Sales by Application
5 China Trade
5.1 Export Overview
5.2 Import Overview
6 Key Companies List
6.1 Nippon Mektron
6.1.1 Company Information
6.1.2 Product Specifications
6.1.3 Business Data (2015-2020) (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
6.2 Unimicron
6.2.1 Company Information
6.2.2 Product Specifications
6.2.3 Business Data (2015-2020) (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
6.3 SEMCO
6.3.1 Company Information
6.3.2 Product Specifications
6.3.3 Business Data (2015-2020) (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
6.4 Young Poong Group
6.4.1 Company Information
6.4.2 Product Specifications
6.4.3 Business Data (2015-2020) (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
6.5 Ibiden
6.5.1 Company Information
6.5.2 Product Specifications
6.5.3 Business Data (2015-2020) (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
6.6 ZDT
6.6.1 Company Information
6.6.2 Product Specifications
6.6.3 Business Data (2015-2020) (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
6.7 Tripod
6.7.1 Company Information
6.7.2 Product Specifications
6.7.3 Business Data (2015-2020) (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
6.8 TTM
6.8.1 Company Information
6.8.2 Product Specifications
6.8.3 Business Data (2015-2020) (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
6.9 SEI
6.9.1 Company Information
6.9.2 Product Specifications
6.9.3 Business Data (2015-2020) (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
6.10 Daeduck Group
6.10.1 Company Information
6.10.2 Product Specifications
6.10.3 Business Data (2015-2020) (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
6.11 HannStar Board (GBM)
6.11.1 Company Information
6.11.2 Product Specifications
6.11.3 Business Data (2015-2020) (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
6.12 Viasystems
6.12.1 Company Information
6.12.2 Product Specifications
6.12.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
6.13 Nanya PCB
6.13.1 Company Information
6.13.2 Product Specifications
6.13.3 Business Data (2015-2020) (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
6.14 CMK Corporation
6.14.1 Company Information
6.14.2 Product Specifications
6.14.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
6.15 Shinko Electric Ind
6.15.1 Company Information
6.15.2 Product Specifications
6.15.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
6.16 Compeq
6.16.1 Company Information
6.16.2 Product Specifications
6.16.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
6.17 AT&S
6.17.1 Company Information
6.17.2 Product Specifications
6.17.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
6.18 Kingboard
6.18.1 Company Information
6.18.2 Product Specifications
6.18.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
6.19 Ellington
6.19.1 Company Information
6.19.2 Product Specifications
6.19.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
6.20 Junda Electronic
6.20.1 Company Information
6.20.2 Product Specifications
6.20.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
6.21 CCTC
6.21.1 Company Information
6.21.2 Product Specifications
6.21.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
6.22 Redboard
6.22.1 Company Information
6.22.2 Product Specifications
6.22.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
6.23 Wuzhou Group
6.23.1 Company Information
6.23.2 Product Specifications
6.23.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
6.24 Kinwong
6.24.1 Company Information
6.24.2 Product Specifications
6.24.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
6.25 Aoshikang
6.25.1 Company Information
6.25.2 Product Specifications
6.25.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
6.26 Shennan Circuits
6.26.1 Company Information
6.26.2 Product Specifications
6.26.3 Business Data (2015-2020) ( Sales Revenue, Cost and Margin)
7 Industry Upstream
7.1 Industry Chain
7.2 Upstream Overview
8 Policies & Market Environment
8.1 Policies
8.1.1 Major Regions Policies
8.1.2 Policies in China
8.2 Market Environment
8.2.1 Porter's Five Forces
8.2.2 Impact of COVID-19
9 Research Conclusion
The global China Clay market is expected to reach US$ XX Million by 2028, with a CAGR of XX% from 2023 to 2028, based on HNY Research newly published report.
The prime objective of this report is to provide the insights on the post COVID-19 impact which will help market players in this field eva...
The global PCB & PCBA market is expected to reach US$ XX Million by 2028, with a CAGR of XX% from 2023 to 2028, based on HNY Research newly published report.
The prime objective of this report is to provide the insights on the post COVID-19 impact which will help market players in this field eva...
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