Asia Pacific advanced IC substrates market will grow by 7.6% annually with a total addressable market cap of $92,888.8 million over 2023-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products sch as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.
Highlighted with 58 tables and 49 figures, this 131-page report "Asia Pacific Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity" is based on a comprehensive research of the entire Asia Pacific advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter's Fiver Forces
The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country.
Based on Packaging Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• FC BGA
• FC CSP
• Other Packaging Types
Based on Material Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate
By Manufacturing Method, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)
By Bonding Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)
By Application, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section.
• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications
Geographically, the following national/local markets are fully investigated:
• Japan
• China
• South Korea
• Australia
• Taiwan
• Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines)
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years is also included.
The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 8
1.1 Industry Definition and Research Scope 8
1.1.1 Industry Definition 8
1.1.2 Research Scope 9
1.2 Research Methodology 12
1.2.1 Overview of Market Research Methodology 12
1.2.2 Market Assumption 13
1.2.3 Secondary Data 13
1.2.4 Primary Data 13
1.2.5 Data Filtration and Model Design 14
1.2.6 Market Size/Share Estimation 15
1.2.7 Research Limitations 16
1.3 Executive Summary 17
2 Market Overview and Dynamics 20
2.1 Market Size and Forecast 20
2.1.1 Impact of COVID-19 on World Economy 22
2.1.2 Impact of COVID-19 on the Market 25
2.1.3 Impact of Russia-Ukraine Conflict: War Slows Economic Recovery 27
2.2 Major Growth Drivers 31
2.3 Market Restraints and Challenges 36
2.4 Emerging Opportunities and Market Trends 39
2.5 Porter's Fiver Forces Analysis 43
3 Segmentation of Asia Pacific Market by Packaging Type 47
3.1 Market Overview by Packaging Type 47
3.2 FC BGA 49
3.3 FC CSP 50
3.4 Other Packaging Types 51
4 Segmentation of Asia Pacific Market by Material Type 52
4.1 Market Overview by Material Type 52
4.2 Rigid Integrated Circuit Substrate 54
4.3 Flex Integrated Circuit Substrate 55
4.4 Ceramic Integrated Circuit Substrate 56
5 Segmentation of Asia Pacific Market by Manufacturing Method 57
5.1 Market Overview by Manufacturing Method 57
5.2 Subtraction Process (SP) 59
5.3 Addition Process (AP) 60
5.4 Modified Semi-additive Process (MSAP) 61
6 Segmentation of Asia Pacific Market by Bonding Technology 62
6.1 Market Overview by Bonding Technology 62
6.2 Wire Bonding 64
6.3 FC Bonding 66
6.4 Tape Automated Bonding (TAB) 68
7 Segmentation of Asia Pacific Market by Application 69
7.1 Market Overview by Application 69
7.2 Mobile and Consumer Electronics 71
7.3 Automotive and Transportation 72
7.4 IT and Telecom 73
7.5 Other Applications 74
8 Asia-Pacific Market 2021-2031 by Country/Region 75
8.1 Overview of Asia-Pacific Market 75
8.2 Japan 78
8.3 China 81
8.4 Australia 83
8.5 Taiwan 85
8.6 South Korea 87
8.7 Rest of APAC Region 89
9 Competitive Landscape 91
9.1 Overview of Key Vendors 91
9.2 New Product Launch, Partnership, Investment, and M&A 94
9.3 Company Profiles 95
ASE Group 95
AT&S Austria Technologie & Systemtechnik AG 97
Fujitsu Ltd. 100
IBIDEN Co., Ltd. 104
Kinsus Interconnect Technology Corp. 106
Korea Circuit Co., Ltd. 108
KYOCERA Corporation 109
LG Innotek Co., Ltd. 112
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) 113
Shenzhen Fastprint Circuit Tech 114
Shinko Electric Industries Co., Ltd. 115
Siliconware Precision Industries Co., Ltd. 118
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD) 120
TTM Technologies Inc. 123
Unimicron Corporation 126
Zhen Ding Technology Holding Ltd. 129
Zhuhai ACCESS Semiconductor 130
RELATED REPORTS 131
Executive Summary
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