Asia Pacific advanced IC substrates market will grow by 7.4% annually with a total addressable market cap of $ 99,969.7 million over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.
Highlighted with 30 tables and 49 figures, this 109-page report "Asia Pacific Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity." is based on a comprehensive research of the entire Asia Pacific advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter's Fiver Forces
The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country.
Based on Packaging Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• FC BGA
• FC CSP
• Other Packaging Types
Based on Material Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Rigid Integrated Circuit Substrate
• Flex Integrated Circuit Substrate
• Ceramic Integrated Circuit Substrate
By Manufacturing Method, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Subtraction Process (SP)
• Addition Process (AP)
• Modified Semi-additive Process (MSAP)
By Bonding Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Wire Bonding
• FC Bonding
• Tape Automated Bonding (TAB)
By Application, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Mobile and Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Other Applications
Geographically, the following national/local markets are fully investigated:
• Japan
• China
• South Korea
• Australia
• Taiwan
• Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines)
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd.
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 7
1.1 Industry Definition and Research Scope 7
1.1.1 Industry Definition 7
1.1.2 Research Scope 8
1.2 Research Methodology 11
1.2.1 Overview of Market Research Methodology 11
1.2.2 Market Assumption 12
1.2.3 Secondary Data 12
1.2.4 Primary Data 12
1.2.5 Data Filtration and Model Design 13
1.2.6 Market Size/Share Estimation 14
1.2.7 Research Limitations 15
1.3 Executive Summary 16
2 Market Overview and Dynamics 19
2.1 Market Size and Forecast 19
2.1.1 Impact of COVID-19 on World Economy 20
2.1.2 Impact of COVID-19 on the Market 25
2.2 Major Growth Drivers 27
2.3 Market Restraints and Challenges 32
2.4 Emerging Opportunities and Market Trends 35
2.5 Porter's Fiver Forces Analysis 39
3 Segmentation of Asia Pacific Market by Packaging Type 43
3.1 Market Overview by Packaging Type 43
3.2 FC BGA 45
3.3 FC CSP 46
3.4 Other Packaging Types 47
4 Segmentation of Asia Pacific Market by Material Type 48
4.1 Market Overview by Material Type 48
4.2 Rigid Integrated Circuit Substrate 50
4.3 Flex Integrated Circuit Substrate 51
4.4 Ceramic Integrated Circuit Substrate 52
5 Segmentation of Asia Pacific Market by Manufacturing Method 53
5.1 Market Overview by Manufacturing Method 53
5.2 Subtraction Process (SP) 55
5.3 Addition Process (AP) 56
5.4 Modified Semi-additive Process (MSAP) 57
6 Segmentation of Asia Pacific Market by Bonding Technology 58
6.1 Market Overview by Bonding Technology 58
6.2 Wire Bonding 60
6.3 FC Bonding 62
6.4 Tape Automated Bonding (TAB) 64
7 Segmentation of Asia Pacific Market by Application 65
7.1 Market Overview by Application 65
7.2 Mobile and Consumer Electronics 67
7.3 Automotive and Transportation 68
7.4 IT and Telecom 69
7.5 Other Applications 70
8 Asia-Pacific Market 2021-2031 by Country/Region 71
8.1 Overview of Asia-Pacific Market 71
8.2 Japan 74
8.3 China 77
8.4 Australia 79
8.5 Taiwan 81
8.6 South Korea 83
8.7 Rest of APAC Region 85
9 Competitive Landscape 87
9.1 Overview of Key Vendors 87
9.2 New Product Launch, Partnership, Investment, and M&A 90
9.3 Company Profiles 91
ASE Group 91
AT&S Austria Technologie & Systemtechnik AG 93
Fujitsu Ltd. 94
IBIDEN Co., Ltd. 95
Kinsus Interconnect Technology Corp. 96
Korea Circuit Co., Ltd. 97
KYOCERA Corporation 98
LG Innotek Co., Ltd. 99
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) 100
Shenzhen Fastprint Circuit Tech 101
Shinko Electric Industries Co., Ltd. 102
Siliconware Precision Industries Co., Ltd. 103
STATS ChipPAC Pte. Ltd. 104
TTM Technologies Inc. 105
Unimicron Corporation 106
Zhen Ding Technology Holding Ltd. 107
Zhuhai ACCESS Semiconductor 108
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